The Simulation Analysis of IGBT Module Based on COMSOL

Abstract IGBT, as the core device of high-capacity power electronic equipment, its stability is directly relevant to normal operation equipment. It would cause system failure and major security incidents if aging phenomenon occurs. A complex multi-physical field coupling process involved in IGBT. Based on Comsol software, this paper conducts a series simulations IGBT module model SKM50GB12T4, also improves simulation solder layer voids by combining with related literature materials science provide basis for subsequent research